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Brief Introduction:
The High Density Leadframe (米乐平台app(中国)有限公司官网) is the latest innovation in the 米乐平台app(中国)有限公司官网 (Quad Flat No-Lead ) packaging evolution that delivers the greatest number of leads per body size while delivering the highest performance at a lower cost. The 米乐平台app(中国)有限公司官网 package and processes were invented and developed by Mr. Li Tung Lok (TL Li) of QPL Limited and uses high density leadframe routing to allow contacts to cover the total bottom area of the package.The 米乐平台app(中国)有限公司官网’s unique two-step LF etching process allows the package to be designed around the die and application and results in the shortest wire bond lengths of any wire bonded technology. With outstanding electrical, thermal, and MSL level 1 performance, the 米乐平台app(中国)有限公司官网 package is ideal for single die, MCM and SIP applications using either Flip Chip and/or Wire Bonding connections. The IC Packaging Technology of the future is here today with 米乐平台app(中国)有限公司官网 solutions.