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Thermal Enhanced
Brief Introduction:
TBGA Stiffeners, heatsinks and lids are used in TBGA packages, flip chip, EBGA packages and leadframe based packages for thermal
management, die protection and mechanical support. Depending on the type of IC is mounted and draws heat from the reverse side of the die for
dissipation directly to ambient or via an attached heatsink in heat slugs embedded in the package assembly and serve as both heat dissipation route
and as a stiffener.